Invention Grant
- Patent Title: Ceramic electronic part and method for manufacturing the same
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Application No.: US16356006Application Date: 2019-03-18
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Publication No.: US10886065B2Publication Date: 2021-01-05
- Inventor: Fumi Mori , Wakaaki Murai
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/12 ; H01G4/012

Abstract:
A ceramic electronic part which includes a ceramic part body substantially in a parallelepiped form and having a first outer electrode at one end portion thereof and a second outer electrode at an opposite end portion thereof. The first outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on one surface in the first direction of the ceramic part body, and the second outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on an other surface in the first direction of the ceramic part body. The ceramic electronic part suffers warpage causing first and second maximum gaps to occur between centers in the second direction of the main parts of the outer electrodes and a virtual plane.
Public/Granted literature
- US20190287720A1 CERAMIC ELECTRONIC PART AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-09-19
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