Invention Grant
- Patent Title: Ceramic electronic component
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Application No.: US16700174Application Date: 2019-12-02
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Publication No.: US10886068B2Publication Date: 2021-01-05
- Inventor: Eui Hyun Jo , Hyun Hee Gu , Jang Yeol Lee , Jong Ho Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0106556 20180906
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/224 ; H01G4/232 ; H01G4/12

Abstract:
A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, first and second external electrodes each including a connection portion disposed on a side surface of the body and a band portion extending from the connection portion to portions of upper/lower and front/rear surfaces of the body, first and second resin layers each disposed between the band portion and the body and extending from an end of the band portion towards each side surface by a predetermined length, in which the predetermined length is within a range of 3 μm to 200 μm.
Information query