A multilayer ceramic electronic device includes a pair of external electrodes respectively covering end surfaces of a main body, wherein a height of the multilayer ceramic electronic device that includes the pair of eternal electrodes is greater than 0.80 times and less than 1.25 times as much as the lessor of a width dimension of the electronic device and a length dimension of the electronic device, and wherein each of the pair of external electrodes includes a tin plating film as an outermost layer, and a thickness of the tin plating film on the end surface of the main body is smaller than a thickness of the tin plating film on side surfaces of the main body.