Invention Grant
- Patent Title: Stage and plasma processing apparatus
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Application No.: US15989518Application Date: 2018-05-25
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Publication No.: US10886109B2Publication Date: 2021-01-05
- Inventor: Hiroki Endo , Katsuyuki Koizumi , Naohiko Okunishi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2017-106736 20170530
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/67

Abstract:
A stage according to an exemplary embodiment has an electrostatic chuck. The electrostatic chuck has a base and a chuck main body. The chuck main body is provided on the base and configured to hold a substrate with electrostatic attractive force. The chuck main body has a plurality of first heaters and a plurality of second heaters. The number of second heaters is larger than the number of first heaters. The first heater controller drives the plurality of first heaters by an alternating current output or a direct current output from a first power source. The second heater controller drives the plurality of second heaters by an alternating current output or a direct current output from a second power source which has electric power lower than electric power of the output from the first power source.
Public/Granted literature
- US20180350570A1 STAGE AND PLASMA PROCESSING APPARATUS Public/Granted day:2018-12-06
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