Invention Grant
- Patent Title: Process for producing sputtering target and sputtering target
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Application No.: US15771196Application Date: 2017-07-10
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Publication No.: US10886111B2Publication Date: 2021-01-05
- Inventor: Mikio Takigawa
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2016-138710 20160713
- International Application: PCT/JP2017/025144 WO 20170710
- International Announcement: WO2018/012460 WO 20180118
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34

Abstract:
A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.
Public/Granted literature
- US20180315586A1 PROCESS FOR PRODUCING SPUTTERING TARGET AND SPUTTERING TARGET Public/Granted day:2018-11-01
Information query
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