Invention Grant
- Patent Title: Platform and method of operating for integrated end-to-end fully self-aligned interconnect process
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Application No.: US16357721Application Date: 2019-03-19
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Publication No.: US10886173B2Publication Date: 2021-01-05
- Inventor: Robert Clark , Kandabara Tapily , Kai-Hung Yu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/768 ; H01L21/67 ; H01L21/66 ; H01L21/677 ; H01L21/02 ; H01L21/285 ; H01L21/311 ; G05B13/02 ; G05B19/418 ; C23C14/24 ; C23C14/34 ; H01J37/32
Abstract:
A method for forming a fully self-aligned via is provided. A workpiece having a pattern of features in a dielectric layer is received into a common manufacturing platform. Metal caps are deposited on the metal features, and a barrier layer is deposited on the metal caps. A first dielectric layer is added to exposed dielectric material. The barrier layer is removed and an etch stop layer is added on the exposed surfaces of the first dielectric layer and the metal caps. Additional dielectric material is added on top of the etch stop layer, then both the additional dielectric material and a portion of the etch stop layer are etched to form a feature to be filled with metal material. An integrated sequence of processing steps is executed within one or more common manufacturing platforms to provide controlled environments. Transfer modules transfer the workpiece between processing modules within and between controlled environments.
Public/Granted literature
- US20190295890A1 PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END FULLY SELF-ALIGNED INTERCONNECT PROCESS Public/Granted day:2019-09-26
Information query
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