- Patent Title: Electrical component testing in stacked semiconductor arrangement
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Application No.: US15354269Application Date: 2016-11-17
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Publication No.: US10886185B2Publication Date: 2021-01-05
- Inventor: Shao-Yu Li , Hao-chieh Chan
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L27/06 ; G01R31/26 ; G01R31/28 ; G01R31/3185
Abstract:
A stacked semiconductor arrangement is provided. The stacked semiconductor arrangement includes a dynamic pattern generator layer having an electrical component. The arrangement also includes a monitoring layer configured to evaluate electrical performance of the electrical component.
Public/Granted literature
- US20170069552A1 ELECTRICAL COMPONENT TESTING IN STACKED SEMICONDUCTOR ARRANGEMENT Public/Granted day:2017-03-09
Information query
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