Invention Grant
- Patent Title: Heat transfer plate
-
Application No.: US15549616Application Date: 2015-12-11
-
Publication No.: US10886191B2Publication Date: 2021-01-05
- Inventor: Reiner Holp , Adolf Dillmann , Stefan Huehner
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102015202300 20150210
- International Application: PCT/EP2015/079383 WO 20151211
- International Announcement: WO2016/128094 WO 20160818
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373 ; H01L23/40 ; H01L23/42 ; F28F3/04

Abstract:
The invention relates to a method for producing an assembly (1), in particular a power electronics unit, comprising the following steps: providing a component (2) to be cooled having a first surface (4), providing a cooling device (3) having a second surface (5) opposite the first surface (4), arranging a 3-dimensional heat transfer plate (6) between the two surfaces (4, 5), wherein the heat transfer plate (6) extends in a plate plane (11) parallel to the two surfaces (4, 5) and in the initial state a plurality of contact extensions (9) which extend outwards with respect to said plate plane (11), and bracing the component (2) and the cooling device (3) relative to one another, such that the contact extensions (9) are deformed in the direction of the metal sheet.
Public/Granted literature
- US20180033713A1 HEAT TRANSFER PLATE Public/Granted day:2018-02-01
Information query
IPC分类: