Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16286536Application Date: 2019-02-26
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Publication No.: US10886221B2Publication Date: 2021-01-05
- Inventor: Takaco Umezawa
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Tokyo
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP2018-172794 20180914
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L23/528 ; H01L23/522 ; H01L27/11524 ; H01L27/11573 ; H01L27/11529 ; H01L27/1157 ; H01L27/11582 ; H01L27/11556

Abstract:
A semiconductor device includes a first wiring extending in a first direction and a second wiring extending in a second direction crossing the first direction and having an end that faces the first wiring and is a predetermined distance away from the first wiring. The predetermined distance is approximately equal to a width of the second wiring, and the end of the second wiring is formed into one or more loops.
Public/Granted literature
- US20200091069A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-03-19
Information query
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