Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16518274Application Date: 2019-07-22
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Publication No.: US10886237B2Publication Date: 2021-01-05
- Inventor: Myoung Soo Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2019-0014298 20190207
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/00 ; H01L29/06 ; H01L29/423 ; H01L23/528

Abstract:
The semiconductor device including a substrate comprising a chip region and a guard-ring region which surrounds a side surface of the chip region, an isolation layer configured to define an active region within the guard-ring region, a first doping layer in the active region and doped with first impurities having a first doping concentration, a second doping layer on the first doping layer and in the active region, the second doping layer doped with second impurities having a same conductivity type as the first impurities of the first doping layer, the second impurities having a second doping concentration, the second doping concentration being greater than the first doping concentration, a first gate electrode on the second doping layer, and a first wire layer on the first gate electrode may be provided.
Public/Granted literature
- US20200258848A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-08-13
Information query
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