Invention Grant
- Patent Title: Multilayer dielectric for metal-insulator-metal capacitor (MIMCAP) capacitance and leakage improvement
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Application No.: US15706047Application Date: 2017-09-15
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Publication No.: US10886362B2Publication Date: 2021-01-05
- Inventor: Takashi Ando , Eduard A. Cartier , Hemanth Jagannathan , Paul C. Jamison
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Kurt Goudy
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L49/02 ; H01L21/02
Abstract:
A tri-layer dielectric stack is provided for a metal-insulator-metal capacitor (MIMCAP). Also, a metal-insulator-metal capacitor (MIMCAP) is provided having three or more electrodes. The tri-layer dielectric stack includes a first layer formed from a first metal oxide electrical insulator. The tri-layer dielectric stack further includes a second layer, disposed over the first layer, formed from ZrO2. The tri-layer dielectric stack also includes a third layer, disposed over the second layer, formed from a second metal oxide electrical insulator.
Public/Granted literature
- US20180240862A1 MULTILAYER DIELECTRIC FOR METAL-INSULATOR-METAL CAPACITOR (MIMCAP) CAPACITANCE AND LEAKAGE IMPROVEMENT Public/Granted day:2018-08-23
Information query
IPC分类:
