Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US16389276Application Date: 2019-04-19
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Publication No.: US10886371B2Publication Date: 2021-01-05
- Inventor: Takashi Tsuji , Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP2018-123719 20180628
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/02 ; H01L21/04 ; H01L21/3213 ; H01L29/78 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/06

Abstract:
A silicon carbide semiconductor device, including a semiconductor substrate having first and second epitaxial layers. The second epitaxial layer is formed on a first main surface of the semiconductor substrate, and includes first and second semiconductor regions, selectively provided in a surface layer of the second epitaxial layer respectively in the active region and the border region, and a third semiconductor region. The semiconductor device further includes a trench penetrating the first and third semiconductor regions to reach the first epitaxial layer, a gate electrode provided in the trench via a gate insulating film, a first electrode electrically connected to the first and third semiconductor regions, and a second electrode provided at a second main surface of the semiconductor substrate. The second semiconductor region is separate from the first semiconductor region. A portion of the third semiconductor region is exposed at the first main surface of the semiconductor substrate, between the first and second semiconductor regions.
Public/Granted literature
- US20200006494A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2020-01-02
Information query
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