Invention Grant
- Patent Title: Solid state optoelectronic device with preformed metal support substrate
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Application No.: US16268670Application Date: 2019-02-06
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Publication No.: US10886444B2Publication Date: 2021-01-05
- Inventor: Vladimir Odnoblyudov
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/62 ; H01L33/00
Abstract:
A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.
Public/Granted literature
- US20190181318A1 SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBSTRATE Public/Granted day:2019-06-13
Information query
IPC分类:
