Invention Grant
- Patent Title: Resistive random access memory device
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Application No.: US15908601Application Date: 2018-02-28
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Publication No.: US10886465B2Publication Date: 2021-01-05
- Inventor: Huei-Tsz Wang , Po-Shu Wang , Wei-Ming Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24 ; H01L27/22 ; H01L43/10 ; H01L23/528 ; H01L23/532

Abstract:
A memory cell includes: a first contact feature partially embedded in a first dielectric layer; a barrier layer, lining the first contact feature, that comprises a first portion disposed between the first contact feature and first dielectric layer, and a second portion disposed above the first dielectric layer; a resistive material layer disposed above the first contact feature, the resistive material layer coupled to the first contact feature through the second portion of the barrier layer; and a second contact feature embedded in a second dielectric layer above the first dielectric layer.
Public/Granted literature
- US20190267544A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2019-08-29
Information query
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