Invention Grant
- Patent Title: Interposer for connecting an antenna on an IC substrate to a dielectric waveguide through an interface waveguide located within an interposer block
-
Application No.: US16136109Application Date: 2018-09-19
-
Publication No.: US10886590B2Publication Date: 2021-01-05
- Inventor: Baher Haroun , Juan Alejandro Herbsommer , Gerd Schuppener , Swaminathan Sankaran
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: H01P5/08
- IPC: H01P5/08 ; H01P11/00 ; H01P3/16

Abstract:
An interposer that acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect is used to establish two well defined reference planes that can be optimized independently. The interposer includes a block of material having a first interface region to interface with an antenna coupled to an integrated circuit (IC) and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.
Public/Granted literature
Information query