In a conductor crimping portion 3, a pair of crimping pieces 3c and 3d having a two-layer structure of an upper layer plate 3a and a lower layer plate 3b connecting the upper layer plate 3a is raised in a U-shape from both sides of a bottom portion 3e. A void 3g is formed inside a folded-back portion of the upper layer plate 3a from the lower layer plate 3b. In the conductor crimping portion 3, the crimping pieces 3c and 3d have a two-layer structure, and a conductor portion is elastically fixed and connection becomes strong due to the presence of the void 3g.