Invention Grant
- Patent Title: Electronic circuitry socket structure
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Application No.: US16201367Application Date: 2018-11-27
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Publication No.: US10886647B2Publication Date: 2021-01-05
- Inventor: Wei Wang , WeiFeng Zhang , YanLong Hou , Ben Wu , Miao Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Grant M. McNeilly
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71 ; H01R12/70 ; H01R13/506 ; H01R43/20 ; H01R13/24

Abstract:
According to some embodiments, a socket for an electronic device includes a housing and pins connected to the housing. The housing includes a base extending laterally and having an inner face and an outer face; a riser connected to the base and extending away from the outer face; a wall extending laterally, connected to the riser, and having an exterior face and an interior face that faces the outer face of the base; mounting ports extending through the base from the inner face to the outer face; and exit ports extending through the wall from the interior face to the exterior face. Each pin includes a portion extending at least partially though one mounting port; a portion extending between the base and the wall; and a portion extending through one exit port.
Public/Granted literature
- US20200169017A1 ELECTRONIC CIRCUITRY SOCKET STRUCTURE Public/Granted day:2020-05-28
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