Invention Grant
- Patent Title: Electrical connector mounted on a substrate with shield structures around the terminals and an insulative housing
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Application No.: US16537462Application Date: 2019-08-09
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Publication No.: US10886669B2Publication Date: 2021-01-05
- Inventor: Takakazu Takahashi
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2018-171318 20180913
- Main IPC: H01R13/6594
- IPC: H01R13/6594 ; H01R12/57 ; H01R12/71 ; H01R13/42 ; H01R12/72 ; H05K1/11 ; H01R13/6593 ; H01R13/502 ; H01R13/6469 ; H01R13/6581 ; H01R13/66 ; H01R13/6587 ; H01R13/40 ; H01R13/648 ; H01R24/50 ; H01R13/516 ; H01R13/6466

Abstract:
A substrate connector includes an insulative housing fixed onto a substrate, a first terminal electrically connected to a first communication line of a communication cable in the inside of the housing and electrically connected to a circuit of the substrate on the outside of the housing, and a second terminal electrically connected to a second communication line of the communication cable in the inside of the housing and electrically connected to the circuit of the substrate on the outside of the housing. The housing includes a main body that is fixed onto the substrate, a terminal-retaining portion arranged in the inside of the main body, integrally formed with the housing, and retains the first and second terminals, and a shell-retaining portion including slit portions formed between the main body and the terminal-retaining portion and to which a shield shell surrounding the first and second terminals is inserted.
Public/Granted literature
- US20200091661A1 SUBSTRATE CONNECTOR Public/Granted day:2020-03-19
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