Invention Grant
- Patent Title: Bonding method for conductor of electric wire and electric wire
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Application No.: US16288454Application Date: 2019-02-28
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Publication No.: US10886684B2Publication Date: 2021-01-05
- Inventor: Tomoya Sato , Kazuhide Takahashi , Naoki Ito , Yasunori Nabeta
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2018-036345 20180301
- Main IPC: H01R4/18
- IPC: H01R4/18 ; H01R43/02 ; B23K20/00 ; B23K20/10 ; B23K101/38

Abstract:
A bonding method for a conductor of an electric wire including a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method includes bonding the strands to each other, the strands being spaced apart from the sheath by a predetermined length. An outer diameter of a middle portion of the conductor between a bonded portion and a portion covered with the sheath gradually decreases toward the bonded portion. A maximum value of an intersection angle between an upper surface of the bonded portion or a longitudinal direction of the electric wire and the strands of the middle portion is smaller than a predetermined angle. The predetermined angle is an angle at which breakage of the strands is prevented when the bonding is performed.
Public/Granted literature
- US20190273355A1 BONDING METHOD FOR CONDUCTOR OF ELECTRIC WIRE AND ELECTRIC WIRE Public/Granted day:2019-09-05
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