Invention Grant
- Patent Title: Preformed solder-in-pin system
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Application No.: US16297116Application Date: 2019-03-08
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Publication No.: US10886685B2Publication Date: 2021-01-05
- Inventor: Dennis J. Johnson
- Applicant: Onanon, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Onanon, Inc.
- Current Assignee: Onanon, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Neustel Law Offices
- Main IPC: H01R43/02
- IPC: H01R43/02 ; H01R24/86 ; H01R4/02 ; H01R13/04 ; H01R107/00

Abstract:
A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.
Public/Granted literature
- US20200287341A1 Preformed Solder-in-Pin System Public/Granted day:2020-09-10
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