Invention Grant
- Patent Title: High performance, scalable multi chip interconnect
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Application No.: US16519112Application Date: 2019-07-23
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Publication No.: US10887238B2Publication Date: 2021-01-05
- Inventor: Carl G. Ramey , Matthew Mattina
- Applicant: Mellanox Technologies Ltd.
- Applicant Address: IL Yokneam
- Assignee: Mellanox Technologies Ltd.
- Current Assignee: Mellanox Technologies Ltd.
- Current Assignee Address: IL Yokneam
- Agency: Kligler & Associates Patent Attorneys Ltd
- Main IPC: H04L12/803
- IPC: H04L12/803 ; G06F15/173 ; H04L29/08 ; H04L12/933

Abstract:
A flexible, scalable server is described. The server includes plural server nodes each server node including processor cores and switching circuitry configured to couple the processor to a network among the cores with the plurality of cores implementing networking functions within the compute nodes wherein the plurality of cores networking capabilities allow the cores to connect to each other, and to offer a single interface to a network coupled to the server.
Public/Granted literature
- US20200177510A1 High Performance, Scalable Multi Chip Interconnect Public/Granted day:2020-06-04
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