The present disclosure provides a method for packaging a camera assembly. The method includes providing a photosensitive chip having a plurality of first soldering pads; mounting a filter on the photosensitive chip; providing a first carrier substrate; and bonding a plurality of functional components and the photosensitive chip to the first carrier substrate. The plurality of functional components has a plurality of second soldering pads, and the first soldering pads and the second soldering pads all face away from the first carrier substrate. The method includes forming an encapsulation layer to cover the first carrier substrate, the photosensitive chip, and the functional components. The encapsulation layer exposes the filter. The method further includes forming a redistribution layer structure, on one side of the encapsulation layer close to the filter, to electrically connect to the first soldering pads and the second soldering pads; and removing the first carrier substrate.