Invention Grant
- Patent Title: Printed circuit board
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Application No.: US16390310Application Date: 2019-04-22
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Publication No.: US10887983B2Publication Date: 2021-01-05
- Inventor: Sung-Jun Lim , Seong-Hwan Park , Kyung-Ho Lee , Kyung-Moon Jung , Chul-Kyu Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0081560 20180713
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K1/11

Abstract:
A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.
Public/Granted literature
- US20200022258A1 PRINTED CIRCUIT BOARD Public/Granted day:2020-01-16
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