Invention Grant
- Patent Title: Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB
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Application No.: US15336221Application Date: 2016-10-27
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Publication No.: US10887997B2Publication Date: 2021-01-05
- Inventor: Kwang-Choon Chung , Byung Woong Moon
- Applicant: INKTEC CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: INKTEC CO., LTD.
- Current Assignee: INKTEC CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2015-0152033 20151030
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K3/12 ; H05K3/06 ; H05K3/00 ; B41F11/00
Abstract:
The present disclosure relates to an apparatus for manufacturing flexible printed circuit board (FPCB) and method for manufacturing the FPCB, having no limitations of length of a circuit pattern being formed on a base film.
Public/Granted literature
- US20170127528A1 Manufacturing Method for FPCB and Manufacturing Apparatus for FPCB Public/Granted day:2017-05-04
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