An electronic assembly includes a PCB coupled to a mounting surface of a cooling jacket circumferentially mounted on a motor and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on a first surface of the PCB proximate to the motor. The TMA includes the cooling jacket, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.