Invention Grant
- Patent Title: Multi-layer substrate apparatus, systems and methods of assembling same
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Application No.: US16212638Application Date: 2018-12-06
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Publication No.: US10888426B2Publication Date: 2021-01-12
- Inventor: Frank Edward Livingston , Timothy Ganey
- Applicant: The Aerospace Corporation
- Applicant Address: US CA El Segundo
- Assignee: The Aerospace Corporation
- Current Assignee: The Aerospace Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Duane Morris, LLP
- Main IPC: A61F2/28
- IPC: A61F2/28 ; B32B3/30 ; A61F2/30

Abstract:
A multi-layer substrate apparatus includes a first layer configured to provide at least one electrical-based property. A second layer proximate to the first layer is configured to provide at least one mechanical-based property. A third proximate to the second layer includes at least one chemical component such that the third layer is enabled to regulate the multi-layer substrate apparatus based on a system that the multi-layer substrate apparatus is being used with. A fourth layer proximate to the third layer is configured to provide at least one magnetic-based property. A fifth layer proximate to the fourth layer is configured to provide support based on the system that the multi-layer substrate apparatus is being used with. The fifth layer includes a geometric portion that is configured to facilitate at least one process therein.
Public/Granted literature
- US20200179119A1 MULTI-LAYER SUBSTRATE APPARATUS, SYSTEMS AND METHODS OF ASSEMBLING SAME Public/Granted day:2020-06-11
Information query
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