Invention Grant
- Patent Title: Protecting hole in component during coating process using plug with water soluble layer
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Application No.: US16110569Application Date: 2018-08-23
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Publication No.: US10888892B2Publication Date: 2021-01-12
- Inventor: Yan Cui , Srikanth Chandrudu Kottilingam , Jonathan Matthew Lomas , Brian Lee Tollison
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Hoffman Warnick LLC
- Main IPC: B05B12/26
- IPC: B05B12/26 ; B05C21/00 ; B05C3/20 ; B05D1/32 ; B05D1/18

Abstract:
A method of protecting a hole in a component during a coating process is disclosed. The method includes: placing a plug in the hole, the plug including a water insoluble core and a water soluble layer surrounding at least a portion of an outer surface of the metal core. A coating is applied over the plug and at least a portion of the component. The component is immersed in water to dissolve the water soluble layer, allowing removal of the water insoluble core. Removal of the coating from over the hole and the water insoluble core from within the hole may follow.
Public/Granted literature
- US20200061662A1 PROTECTING HOLE IN COMPONENT DURING COATING PROCESS USING PLUG WITH WATER SOLUBLE LAYER Public/Granted day:2020-02-27
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