Invention Grant
- Patent Title: Laminated structure and method for producing the same
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Application No.: US16092821Application Date: 2017-03-24
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Publication No.: US10889082B2Publication Date: 2021-01-12
- Inventor: Toshihiro Miura
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2016-084243 20160420
- International Application: PCT/JP2017/012028 WO 20170324
- International Announcement: WO2017/183390 WO 20171026
- Main IPC: B32B3/18
- IPC: B32B3/18 ; H01L21/768 ; H01L51/05 ; H01L51/42 ; H01L21/02 ; H01L23/10 ; H01L23/532

Abstract:
Disclosed herein is a laminated structure including a first layer covering a substrate and a raised portion existing on the substrate, and a second layer covering the first layer, in which a first seam is formed inside the first layer, starting from a part at which the raised portion rises from the substrate or a vicinity of the rising part as a start point, a second seam is formed inside the second layer, starting from a part at which the first layer positioned above the substrate rises or a part of the second layer corresponding to a vicinity of the rising part as a start point, and the first seam and the second seam are discontinuous.
Public/Granted literature
- US20190118503A1 LAMINATED STRUCTURE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2019-04-25
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