Invention Grant
- Patent Title: Heat pump apparatus
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Application No.: US16486874Application Date: 2017-11-22
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Publication No.: US10890355B2Publication Date: 2021-01-12
- Inventor: Yasumitsu Nomura , Shigetoshi Ipposhi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Xsensus LLP
- Priority: JP2017-082928 20170419
- International Application: PCT/JP2017/041983 WO 20171122
- International Announcement: WO2018/193658 WO 20181025
- Main IPC: F24H4/02
- IPC: F24H4/02 ; F24H7/02 ; F24H9/20 ; F25B6/04 ; F25B30/02 ; F25B41/04 ; F28D20/02

Abstract:
A heat pump apparatus includes a use-side heat exchanger that causes heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.
Public/Granted literature
- US20200011569A1 HEAT PUMP APPARATUS Public/Granted day:2020-01-09
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