- Patent Title: Module architecture for large area ultrasonic fingerprint sensor
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Application No.: US16289394Application Date: 2019-02-28
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Publication No.: US10891458B2Publication Date: 2021-01-12
- Inventor: Jae Hyeong Seo , Kostadin Dimitrov Djordjev , Hrishikesh Vijaykumar Panchawagh , Sameer Wadhwa , Nicholas Ian Buchan , Yipeng Lu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01S7/52 ; G01S15/89

Abstract:
An ultrasonic fingerprint sensor system of the present disclosure may be provided with an ultrasonic transmitter or ultrasonic transceiver having an electrode layer divided into a plurality of electrode segments. The ultrasonic fingerprint sensor system may detect an object over one or more electrode segments and provide a voltage burst to one or more selected electrode segments for localized generation of ultrasonic waves. The localized generation of ultrasonic waves may facilitate localized readout for imaging. In some implementations, the voltage burst may be provided in a single-ended drive scheme or differential drive scheme.
Public/Granted literature
- US20200279087A1 MODULE ARCHITECTURE FOR LARGE AREA ULTRASONIC FINGERPRINT SENSOR Public/Granted day:2020-09-03
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