Invention Grant
- Patent Title: Electronic component
-
Application No.: US15790748Application Date: 2017-10-23
-
Publication No.: US10892084B2Publication Date: 2021-01-12
- Inventor: Jae Wook Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0151999 20161115
- Main IPC: H01F27/255
- IPC: H01F27/255 ; H01F17/00 ; H01F27/02 ; H01F27/28 ; H01F41/04 ; H01F27/29 ; H01F17/04

Abstract:
An electronic component includes: a body including a coil part disposed therein and containing magnetic metal particles; and a surface protection layer disposed on a surface of the body. The magnetic metal particles comprise two or more kinds of particles having different particle sizes from each other, a portion of the magnetic metal particles are exposed to the surface of the body, and uneven regions are formed on the regions of the surfaces of the magnetic metal particles exposed to the surface of the body, and the surface protection layer is in contact with the uneven regions.
Public/Granted literature
- US20180137965A1 ELECTRONIC COMPONENT Public/Granted day:2018-05-17
Information query