Invention Grant
- Patent Title: Circuit board assemblies having magnetic components
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Application No.: US15832415Application Date: 2017-12-05
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Publication No.: US10892085B2Publication Date: 2021-01-12
- Inventor: Kwong Kei Chin
- Applicant: Astec International Limited
- Applicant Address: HK Kowloon
- Assignee: Astec International Limited
- Current Assignee: Astec International Limited
- Current Assignee Address: HK Kowloon
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/02 ; H01F27/24 ; H01F27/29 ; H05K1/02 ; H05K1/18

Abstract:
According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.
Public/Granted literature
- US20180166203A1 Circuit Board Assemblies Having Magnetic Components Public/Granted day:2018-06-14
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