A substrate cleaning roll that has a cylindrical shape and scrubs a surface of a substrate by rotating about a rotational axis in a longitudinal direction in contact with the substrate, the longitudinal direction being parallel to the surface of the substrate, the substrate cleaning roll including a bevel cleaner at least at one end of the substrate cleaning roll in the longitudinal direction, the bevel cleaner including a sloping surface to be in contact with an outermost edge of a bevel portion at a rim of the substrate when the substrate cleaning roll comes into contact with the substrate and cleans the surface of the substrate.