Invention Grant
- Patent Title: Lift pin assembly
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Application No.: US14450241Application Date: 2014-08-02
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Publication No.: US10892180B2Publication Date: 2021-01-12
- Inventor: Bonnie T. Chia , Jallepally Ravi , Manjunatha Koppa , Vinod Konda Purathe , Cheng-Hsiung Matthew Tsai , Aravind Miyar Kamath
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C16/46 ; H01L21/683 ; H01L21/67 ; C30B25/12
Abstract:
Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.
Public/Granted literature
- US20150348823A1 LIFT PIN ASSEMBLY Public/Granted day:2015-12-03
Information query
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