Invention Grant
- Patent Title: Method for creating a fully self-aligned via
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Application No.: US16411437Application Date: 2019-05-14
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Publication No.: US10892187B2Publication Date: 2021-01-12
- Inventor: Regina Freed , Uday Mitra , Sanjay Natarajan
- Applicant: Micromaterials LLC
- Applicant Address: US DE Wilmington
- Assignee: Micromaterials LLC
- Current Assignee: Micromaterials LLC
- Current Assignee Address: US DE Wilmington
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L23/522 ; H01L23/532 ; H01L21/02
Abstract:
Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure provide an electronic device having a bridging via between a first metallization and a third metallization layer, the bridging via not contacting a second metallization layers. Methods of providing self-aligned bridging vias are also described.
Public/Granted literature
- US20190355620A1 Method For Creating A Fully Self-Aligned Via Public/Granted day:2019-11-21
Information query
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