Invention Grant
- Patent Title: Semiconductor package structure, product and method for manufacturing the same
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Application No.: US16372107Application Date: 2019-04-01
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Publication No.: US10892199B2Publication Date: 2021-01-12
- Inventor: Yu-Ming Chen , Yu-Sung Lin , Tai-Hung Kuo
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/544 ; H01L21/48
Abstract:
A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.
Public/Granted literature
- US20200312730A1 SEMICONDUCTOR PACKAGE STRUCTURE, PRODUCT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-10-01
Information query
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