Invention Grant
- Patent Title: Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor device
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Application No.: US16085263Application Date: 2017-03-24
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Publication No.: US10892204B2Publication Date: 2021-01-12
- Inventor: Tatsuo Kumura , Yusuke Kubo , Keisuke Aramaki , Hiroyuki Ryoson
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenja IP Law PC
- Priority: JP2016-062335 20160325
- International Application: PCT/JP2017/012155 WO 20170324
- International Announcement: WO2017/164406 WO 20170928
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H05K9/00 ; H01L23/42 ; H01L23/552 ; H01L23/373 ; H05K7/20 ; H01L23/28
Abstract:
Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.
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