Invention Grant
- Patent Title: Heat dissipation apparatus and method for power semiconductor devices
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Application No.: US15787711Application Date: 2017-10-19
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Publication No.: US10892208B2Publication Date: 2021-01-12
- Inventor: Hung-Li Chang , Lon C. Cooper , David L. Bogdanchik
- Applicant: Hung-Li Chang , Lon C. Cooper , David L. Bogdanchik
- Applicant Address: US CA Chino Hills; US CA Azusa; US CA Pasadena
- Assignee: Hung-Li Chang,Lon C. Cooper,David L. Bogdanchik
- Current Assignee: Hung-Li Chang,Lon C. Cooper,David L. Bogdanchik
- Current Assignee Address: US CA Chino Hills; US CA Azusa; US CA Pasadena
- Agency: The Law Office of Kevin M. Welch
- Agent Kevin Matthew Welch
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/367 ; H01L25/11 ; H01L23/40

Abstract:
An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
Public/Granted literature
- US20190139862A1 HEAT DISSIPATION APPARATUS AND METHOD FOR POWER SEMICONDUCTOR DEVICES Public/Granted day:2019-05-09
Information query
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