Invention Grant
- Patent Title: Magnetic shielding material with insulator-coated ferromagnetic particles
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Application No.: US16405642Application Date: 2019-05-07
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Publication No.: US10892230B2Publication Date: 2021-01-12
- Inventor: Tsung-Hsing Lu , Pei-Haw Tsao , Li-Huan Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/495 ; H05K9/00
Abstract:
A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.
Public/Granted literature
- US20200035615A1 MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PARTICLES Public/Granted day:2020-01-30
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