Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16316957Application Date: 2017-07-27
-
Publication No.: US10892319B2Publication Date: 2021-01-12
- Inventor: Seigo Mori , Masatoshi Aketa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson., P.C.
- Priority: JP2016-161486 20160819
- International Application: PCT/JP2017/027320 WO 20170727
- International Announcement: WO2018/034127 WO 20180222
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/16 ; H01L29/739 ; H01L29/78

Abstract:
[Object] To provide a semiconductor device which can achieve not only satisfactory switching characteristics in both a small current region and a large current region but also a satisfactory reverse withstand voltage.
[Solution Means] A semiconductor device is provided that includes a semiconductor layer having a front surface, a back surface on a side opposite thereto, and an end surface, an MIS transistor structure which is formed on a front surface portion of the semiconductor layer, a first conductivity type portion and a second conductivity type portion which are formed adjacent to each other on the side of the back surface of the semiconductor layer, and a first electrode which is formed on the back surface of the semiconductor layer, which forms a Schottky junction with the first conductivity type portion and which is in ohmic contact with the second conductivity type portion.
[Solution Means] A semiconductor device is provided that includes a semiconductor layer having a front surface, a back surface on a side opposite thereto, and an end surface, an MIS transistor structure which is formed on a front surface portion of the semiconductor layer, a first conductivity type portion and a second conductivity type portion which are formed adjacent to each other on the side of the back surface of the semiconductor layer, and a first electrode which is formed on the back surface of the semiconductor layer, which forms a Schottky junction with the first conductivity type portion and which is in ohmic contact with the second conductivity type portion.
Public/Granted literature
- US20200020765A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-01-16
Information query
IPC分类: