Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US16803130Application Date: 2020-02-27
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Publication No.: US10892342B2Publication Date: 2021-01-12
- Inventor: Wonkeun Chung , Jae-Jung Kim , Jinkyu Jang , Sangyong Kim , Hoonjoo Na , Dongsoo Lee , Sangjin Hyun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2017-0115343 20170908
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/786 ; H01L29/775 ; H01L29/06 ; H01L29/66 ; H01L29/51 ; H01L29/49 ; H01L27/11 ; H01L21/28 ; B82Y10/00

Abstract:
A semiconductor device includes first semiconductor patterns vertically stacked on a substrate and vertically spaced apart from each other, and a first gate electrode on the first semiconductor patterns. The first gate electrode comprises a first work function metal pattern on a top surface, a bottom surface, and sidewalls of respective ones of the first semiconductor patterns, a barrier pattern on the first work function metal pattern, and a first electrode pattern on the barrier pattern. The first gate electrode has a first part between adjacent ones of the first semiconductor patterns. The barrier pattern comprises a silicon-containing metal nitride layer. The barrier pattern and the first electrode pattern are spaced apart from the first part.
Information query
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