The present application provides a vapor deposition method, a deposition mask, and a vapor deposition apparatus that make it possible to reliably and uniformly separate the deposition mask in a short time after vapor deposition is performed using a vapor deposition material. In Step (S1), a deposition mask that at least partly has a metal layer (metal support layer) made of a ferromagnetic material is formed. In Step (S2), the metal layer of the deposition mask is magnetized by applying an electromagnetic field to the metal layer. In Step (S3), the deposition mask and a substrate are aligned with each other, and then the deposition mask is attracted and fixed to an electromagnet with the substrate) therebetween. In Step (S4), a vapor deposition source is disposed so as to face the deposition mask, and a vapor deposition material in the vapor deposition source is deposited on the substrate by vaporizing the vapor deposition material. In Step (S5), the electromagnet generates a magnetic field to cause the deposition mask to repel the electromagnet, thereby separating both the electromagnet and the substrate from the deposition mask.