Invention Grant
- Patent Title: Acoustic filter with packaging-defined boundary conditions and method for producing the same
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Application No.: US15993155Application Date: 2018-05-30
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Publication No.: US10892730B2Publication Date: 2021-01-12
- Inventor: You Qian , Humberto Campanella-Pineda , Rakesh Kumar
- Applicant: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agent Winston Hsu
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/02 ; H01L41/053 ; H03H9/56 ; H03H9/13 ; H03H9/205 ; H01L41/047 ; H01L41/23 ; H01L41/187 ; H01L41/193

Abstract:
A BAW resonator/filter with a monolithic TFE package that defines an acoustic BC and suppresses resonances from the low-Q piezoelectric area of the resonator and resulting devices are provided. Embodiments include a BAW resonator over a dielectric layer, the BAW resonator including a first metal layer, a thin-film piezoelectric layer, and a second metal layer; a first cavity in the dielectric layer under the first metal layer and a second cavity over the first cavity on the second metal layer; and a pair of TFE anchors on the second metal layer, each TFE anchor adjacent to and on an opposite side of the second cavity and extending beyond the first metal layer.
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