Invention Grant
- Patent Title: Earphone
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Application No.: US16744712Application Date: 2020-01-16
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Publication No.: US10893355B2Publication Date: 2021-01-12
- Inventor: Yuanqing Huang
- Applicant: SHENZHEN MEES HI-TECH CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN MEES HI-TECH CO., LTD.
- Current Assignee: SHENZHEN MEES HI-TECH CO., LTD.
- Current Assignee Address: CN Shenzhen
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H01R12/71 ; H02J7/00 ; H01R13/24 ; H04R1/08 ; H04R1/34

Abstract:
The earphone comprises a main housing; a cover; a speaker module; a circuit module; and a power supply. The cover is buckled on the main housing. The speaker module, the circuit module, and the power supply are disposed within a space enclosed by the main housing and the cover. The speaker electrical connector is used to achieve an electrical connection between the speaker body and the circuit module in an elastic contact manner. The battery electrical connector is used to achieve electrical connection with the circuit board in the elastic contact manner.
Public/Granted literature
- US20200374621A1 EARPHONE Public/Granted day:2020-11-26
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