Invention Grant
- Patent Title: Rigid-flexible printed circuit bord fabrication using inkjet printing
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Application No.: US16477409Application Date: 2018-01-11
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Publication No.: US10893612B2Publication Date: 2021-01-12
- Inventor: Hila Elimelech , Einav Amit
- Applicant: NANO-DIMENSION TECHNOLOGIES, LTD. , THE IP LAW FIRM OF GUY LEVI, LLC
- Applicant Address: IL Nes Ziona; US NJ Wyckokoff
- Assignee: NANO-DIMENSION TECHNOLOGIES, LTD.,THE IP LAW FIRM OF GUY LEVI, LLC
- Current Assignee: NANO-DIMENSION TECHNOLOGIES, LTD.,THE IP LAW FIRM OF GUY LEVI, LLC
- Current Assignee Address: IL Nes Ziona; US NJ Wyckokoff
- Agency: The IP Law Firm of Guy Levi, LLC
- Agent Guy Levi
- International Application: PCT/US2018/013370 WO 20180111
- International Announcement: WO2018/132603 WO 20180719
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/09 ; H05K3/12 ; H05K3/46 ; B33Y80/00

Abstract:
The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
Public/Granted literature
- US20200037451A1 RIGID-FLEXIBLE PRINTED CIRCUIT BORD FABRICATION USING INKJET PRINTING Public/Granted day:2020-01-30
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