Invention Grant
- Patent Title: Circuit board cooling
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Application No.: US16246296Application Date: 2019-01-11
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Publication No.: US10893628B2Publication Date: 2021-01-12
- Inventor: Sankalp Dayal , Vamshi Gangumalla , Zaryab Hamavand , Calin Miclaus
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G01F1/88 ; H05K7/14 ; G06F1/3296 ; G06F1/3228

Abstract:
A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
Public/Granted literature
- US20190150316A1 CIRCUIT BOARD COOLING Public/Granted day:2019-05-16
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