A high frequency power circuit module includes an electronic circuit substrate having a bending section, a high frequency power circuit formed on the electronic circuit substrate, a battery connected to the high frequency power circuit, and a magnetic material sheet having an area larger than that of the battery. The battery is covered with the magnetic material sheet in a state in which the electronic circuit substrate is bent at a bending section. The high frequency power circuit, the battery, and the magnetic material sheet are thermally coupled to each other by a resin sealing member, which is a material having a smaller thermal resistance than that of air.