Invention Grant
- Patent Title: Hair care composition with encapsulated moisturizers and method to deliver extended moisture release to the hair
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Application No.: US15723655Application Date: 2017-10-03
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Publication No.: US10894007B2Publication Date: 2021-01-19
- Inventor: Mary J Conway , Jisook Baek
- Applicant: Henkel IP & Holding GmbH , Henkel (China) Investment Co., Ltd.
- Applicant Address: DE Duesseldorf; CN Shanghai
- Assignee: Henkel IP & Holding GmbH,Henkel (China) Investment Co., Ltd.
- Current Assignee: Henkel IP & Holding GmbH,Henkel (China) Investment Co., Ltd.
- Current Assignee Address: DE Duesseldorf; CN Shanghai
- Agent James J. Cummings
- Priority: CN201610942398 20161026
- Main IPC: A61K8/11
- IPC: A61K8/11 ; A61K8/39 ; A61K8/34 ; A61K8/37 ; A61K8/44 ; A61K8/891 ; A61K8/46 ; A61K8/81 ; A61K8/41 ; A45D34/00 ; A61Q5/00 ; A61Q5/02 ; A61Q5/06 ; A61Q5/12
Abstract:
Methods and composition are provided for a hair care composition that comprises at least one encapsulated moisturizing ingredient. The composition comprises at least one surfactant, at least one capsule that encapsulates a benefit agent, and a carrier. The composition may further comprise additional components, which may be a function of the type of hair care composition. A method of using a hair care composition that comprises at least one encapsulated moisturizing ingredient is also provided.
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