Invention Grant
- Patent Title: Method for producing polishing composition and polishing method
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Application No.: US16317448Application Date: 2017-06-12
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Publication No.: US10894901B2Publication Date: 2021-01-19
- Inventor: Yoshihiro Izawa , Shota Suzuki
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: Foley & Lardner LLP
- Priority: JP2016-140568 20160715
- International Application: PCT/JP2017/021694 WO 20170612
- International Announcement: WO2018/012175 WO 20180118
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; H01L21/304 ; B24B37/00 ; H01L21/306
Abstract:
The present invention provides a method for producing a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects).
The present invention is a method for producing a polishing composition, the method including: preparing silica in which an intensity of a peak of a silica four-membered ring structure and an intensity of a peak derived from a silica random network structure when analyzed by Raman spectroscopy satisfy a predetermined requirement; and mixing the silica with a dispersing medium.
The present invention is a method for producing a polishing composition, the method including: preparing silica in which an intensity of a peak of a silica four-membered ring structure and an intensity of a peak derived from a silica random network structure when analyzed by Raman spectroscopy satisfy a predetermined requirement; and mixing the silica with a dispersing medium.
Public/Granted literature
- US20190300751A1 METHOD FOR PRODUCING POLISHING COMPOSITION AND POLISHING METHOD Public/Granted day:2019-10-03
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