Invention Grant
- Patent Title: Metallic structure
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Application No.: US15345863Application Date: 2016-11-08
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Publication No.: US10895006B2Publication Date: 2021-01-19
- Inventor: Jian Lu , Ge Wu
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner, Kenner, Greive, Bobak, Taylor & Weber
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C23C14/35 ; C23C14/16 ; C23C14/54 ; C23C14/02 ; C22C18/00 ; C22C1/00 ; C22C45/00 ; C22F1/06 ; C23C28/02 ; C23C30/00 ; C23C14/18 ; C22F1/047 ; C23C14/58 ; C23C28/00 ; C22F3/00 ; C22C23/00 ; C23C14/14 ; B32B7/02 ; B32B15/00 ; B32B15/16 ; C22C23/02 ; C22C23/04
Abstract:
A metallic structure includes a first plurality of metal particles arranged in an amorphous structure; a second plurality of metal particles arranged in a crystalline structure having at least two grain sizes, wherein the crystalline structure is arranged to receive the amorphous structure deposited thereon; wherein the grain size is arranged in a gradient structure.
Public/Granted literature
- US20180127867A1 METALLIC STRUCTURE AND A METHOD FOR USE IN FABRICATING THEREOF Public/Granted day:2018-05-10
Information query
